Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years – CVD Cobalt process | A Blog for Browsing Mining, Mineral Processing, and Metals Info

Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years – CVD Cobalt process

Posted on May 14, 2014 by Nanthakumar Victor Emmanuel, P.Eng Leave a comment

SANTA CLARA, Calif., May 13, 2014 – Applied Materials, Inc. today announced its Applied Endura(R) Volta(TM) CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films. The two enabling applications, a conformal cobalt liner and a selective cobalt capping layer, provide complete enclosure of the copper lines, improving reliability by an order of magnitude. The introduction of cobalt as a superior metal encapsulation film marks the most significant materials change to the interconnect in over 15 years.